NEPHELE – A Lightweight Software Stack and Synergetic Meta-Orchestration Framework for the Next Generation Compute Continuum
At a glance
- Project leader : Dr. Leonardo Militano
- Project team : Dr. Giovanni Toffetti Carughi
- Project status : ongoing
- Funding partner : EU and other international programmes (Horizon Europe / Projekt Nr. 101070487)
- Project partner : National Technical University Of Athens, Consorzio nazionale interuniversitario per le telecomunicazioni CNIT, Siemens Deutschland AG, Atos IT Solutions And Services Iberia S.L., Institut national de recherche en informatique et en automatique INRIA, University of Macedonia, FundingBox Accelerator sp. z o. o., Odin Solutions S.L., alter way S.A., Internet Institute, Communications Solutions and Consulting LTD, Eclipse Foundation Europe GmbH, WINGS ICT Solutions, IBM Ireland Ltd., ESAOTE SPA, GEIE ERCIM
- Contact person : Leonardo Militano
Description
The main vision for the NEPHELE project is to enable efficient, reliable and secure end-to-end orchestration of hyper-distributed applications over programmable infrastructure that is spanning across the compute continuum from Cloud-to-Edge-to-IoT. Together with other 17 great partners from industry and academia, ZHAW will collaborate on this three-year project to efficiently enable data management and analysis over such distributed environment, while exploiting resources in the continuum from Cloud-to-Edge-to-IoT.
Publications
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Militano, Leonardo; Arteaga, Adriana; Toffetti Carughi, Giovanni; Mitton, Nathalie,
2023.
The cloud-to-edge-to-IoT continuum as an enabler for search and rescue operations.
Future Internet.
15(2), pp. 55.
Available from: https://doi.org/10.3390/fi15020055
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Murphy, Seán; Militano, Leonardo; Toffetti Carughi, Giovanni; Maurer, Remo,
2022.
Efficient delivery of robotics programming educational content using cloud robotics [paper].
In:
2022 7th International Conference on Robotics and Automation Engineering (ICRAE 2022).
7th International Conference on Robotics and Automation Engineering (ICRAE), Singapore, 18-20 November 2022.
IEEE.
pp. 222-226.
Available from: https://doi.org/10.1109/ICRAE56463.2022.10056179