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Development of Abrasive Blades for Wafer Dicing by Using Ceramic Tape Casting Technology (AbraCas)

Left: New development of dicing blades, right: dicing grooves

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Meister Abrasives AG and ZHAW intend to develop a completely new process for the production of dicing blades for wafers used in high tech industries (semiconductors, MEMS). With the new process based on ceramic tape casting technology adapted to vitreous bonded diamond abrasives limitations of the current production process will be overcome. It will lead to thinner blades with controlled and tailorable microstructure using vitreous bond systems.